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3M - Low-Melt Glue Sticks

Low-melt is applied at 265 F. to bond heat sensitive substrates such as polystyrene foam. Excellent "hot-tack" when dispensed at low-melt temperatures. Can bond expanded polystyrene, corrugated packaging and displays. 25 second bonding range. FDA listed.

3M - Low-Melt Glue Sticks

3M - Low-Melt Glue Sticks

  Item Color Strength/Material Length Add
GL3M3762Q
Light Tan
Low-Melt Glue
8.000
GL3M3792Q
Clear
Low-Melt Glue
8.000
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